Abstract
A method is presented to test automatically for latent faults, those
which elude detection during conventional electronic testing, on printed
circuit boards. Testing is intended for implementation in a volume
manufacturing environment and involves the application of infrared
imaging tools. Successful incorporation of infrared testing into
existing test processes requires that: a procedure for handling variable
radiation heat transfer properties across a printed circuit board be
developed; a thermally-controlled test enclosure be provided; PASS/FAIL
criteria be established. These tasks are addressed, testing procedures
are described, and favorable results are presented. The feasibility of
an infrared test process is demonstrated.